The Electronic Packaging Handbook (Electronics Handbook Series)

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The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.

The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.

Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

The Electronic Packaging Handbook (Electronics Handbook Series) Review

This book is a highly recommended reference for all mechanical (and, I suppose, some electrical) engineers working on packaging. The book covers many topics with enough detail so that the engineer may have a good holistic understanding of everything from: - pcb design, layout and fabrication - component fundamentals including IC's - EMC issues - interconnect issues - reliability - testingHowever, the book won't replace practical experience since the areas detailing typical manufacturing issues are very weak. In particular, you won't get fundamental machine-shop information relating to design materials and processing. That is, this book won't replace a thorough knowledge of basic machining-type information covered in the good old "Machinery's Handbook". Analysis related to mechanical issues such as FEA and CAD is not covered.The book is rather weak in its thermal section and has nothing about fiber optic design or MEMs/MOEMs. These areas should be addressed in future editions to keep it up to date. Help other customers find the most helpful reviews� Was this review helpful to you?�Yes No Report abuse | PermalinkComment�Comment

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